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Full details of how to solder a IC using QFP

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Quad Flat Package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common.

The QFP component package type became common during the early nineties, even though it has been used in electronics since the seventies. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board (PCB). A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR flash memories and other programmable components.

But, QFP has connections only around the periphery of the package. To increase the number of pins, the spacing was decreased from 50 mil to 20 and later 12 (1.27 mm, 0.51 mm and 0.30 mm respectively). However, this close lead spacing made solder bridges more likely and put higher demands on the soldering process and alignment of parts during assembly.Full details on how to solder a chip using a quad flat pack.

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